JPH0429557Y2 - - Google Patents
Info
- Publication number
- JPH0429557Y2 JPH0429557Y2 JP6550586U JP6550586U JPH0429557Y2 JP H0429557 Y2 JPH0429557 Y2 JP H0429557Y2 JP 6550586 U JP6550586 U JP 6550586U JP 6550586 U JP6550586 U JP 6550586U JP H0429557 Y2 JPH0429557 Y2 JP H0429557Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- case
- dust
- driver plate
- driver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 229920001971 elastomer Polymers 0.000 claims description 12
- 239000003990 capacitor Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- WWTBZEKOSBFBEM-SPWPXUSOSA-N (2s)-2-[[2-benzyl-3-[hydroxy-[(1r)-2-phenyl-1-(phenylmethoxycarbonylamino)ethyl]phosphoryl]propanoyl]amino]-3-(1h-indol-3-yl)propanoic acid Chemical compound N([C@@H](CC=1C2=CC=CC=C2NC=1)C(=O)O)C(=O)C(CP(O)(=O)[C@H](CC=1C=CC=CC=1)NC(=O)OCC=1C=CC=CC=1)CC1=CC=CC=C1 WWTBZEKOSBFBEM-SPWPXUSOSA-N 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 229940126208 compound 22 Drugs 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- -1 fluorine film Chemical class 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6550586U JPH0429557Y2 (en]) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6550586U JPH0429557Y2 (en]) | 1986-04-30 | 1986-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62178525U JPS62178525U (en]) | 1987-11-12 |
JPH0429557Y2 true JPH0429557Y2 (en]) | 1992-07-17 |
Family
ID=30902636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6550586U Expired JPH0429557Y2 (en]) | 1986-04-30 | 1986-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0429557Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0766294B2 (ja) * | 1988-06-20 | 1995-07-19 | シルバー株式会社 | 電磁ポンプ等の負荷駆動回路の調整方法およびその調整装置 |
-
1986
- 1986-04-30 JP JP6550586U patent/JPH0429557Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62178525U (en]) | 1987-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5087961A (en) | Semiconductor device package | |
EP0098028A3 (en) | Hermetically sealable package for hybrid solid-state electronic devices and the like | |
WO1989004552A1 (en) | Method and means of fabricating a semiconductor device package | |
JPH0429557Y2 (en]) | ||
JPS5835367B2 (ja) | 回路素子基板及びその製造方法 | |
JPS59110217A (ja) | チツプ形状の圧電振動部品とその製造方法 | |
JPS629728Y2 (en]) | ||
JPS6258655B2 (en]) | ||
JPS61237403A (ja) | 電子部品 | |
JPH01112805A (ja) | 圧電部品の製造方法 | |
JP2000058575A (ja) | 樹脂封止形リードフレーム組立体及びその製造方法 | |
JPS6148915A (ja) | 可変磁器コンデンサ | |
JPS6328607Y2 (en]) | ||
TW511258B (en) | Substrate-on-chip packaging process | |
JPH0314038Y2 (en]) | ||
JPH0650991Y2 (ja) | 半導体素子収納用パッケージ | |
JPH0653570A (ja) | 弾性表面波デバイスの製造方法 | |
JPH0620809A (ja) | 高電圧用可変抵抗器の製造方法 | |
JPH04115540A (ja) | 放熱板付き半導体装置の製造方法 | |
JPH027411A (ja) | 圧電部品の製造方法 | |
JPH0452621B2 (en]) | ||
JPS61237382A (ja) | リ−ド取付方法 | |
JPH0338806Y2 (en]) | ||
JPS635817Y2 (en]) | ||
JPH02114604A (ja) | 電子部品 |